2026-09-14 · Fuente：TechPowerUp
The two chipmakers are developing organic bridge technology using PCB-like redistribution layers, targeting packaging densities comparable to Intel's silicon-based EMIB approach for multi-die designs.
Samsung and Qualcomm are reportedly forming a 2.1D packaging alliance intended to give customers access to advanced chip packaging built around bridges that connect silicon dies. Central to the initiative is an organic bridge technology the two companies are jointly developing, which serves as the adhesive holding two chips together. The concept follows a route Intel has already taken with its own packaging technology, though with a different choice of bridge material.
Intel's Embedded Multi-die Interconnect Bridge (EMIB) follows a similar concept, though it employs bridges cut from silicon. The Samsung-Qualcomm effort will instead rely on organic bridges built from materials typical of conventional PCBs — epoxy-type organic polymers paired with copper wiring — to link several chips within one package. Drawing those ingredients from the board-level supply chain pushes the process nearer to PCB production than to silicon chipmaking.
The organic bridge is built on redistribution layers, or RDL — multiple layers of fine circuitry defined by extremely small wires and tight spacing between them. According to the report, this construction allows packaging densities that closely match modern silicon-based EMIB, even though the underlying process resembles board-level production rather than wafer-level chipmaking. Samsung is expected to manufacture the 2.1D package with multiple RDLs assembled inside a flip-chip ball grid array package.
The engineering targets are specific. Samsung ultimately aims for the organic bridge's line width and spacing to reach 1.5 to 2 micrometers each, with vias sized at 4 to 5 micrometers. Die-to-die pattern density is targeted at 500 to 1,000 per millimeter. Those figures would put a PCB-derived packaging technique within reach of silicon-bridge interconnect density — a combination that could expand customer options for multi-die designs if the reported alliance delivers on its roadmap.
Etiquetas: Samsung · Qualcomm · Intel · 2.1D Packaging · Advanced Packaging · EMIB
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