2026-09-10 · Fuente：HotHardware
Samsung and TSMC are aligning with ASML to bring High Numerical Aperture EUV lithography into production, pairing the next-generation tools with a coordinated move to larger 12-inch formats.
Samsung and TSMC have committed to adopting ASML's next-generation High Numerical Aperture Extreme Ultraviolet (High NA EUV) lithography, folding the technology into their manufacturing operations in a coordinated move that marks the semiconductor industry entering a new phase. The three-way alignment is aimed squarely at a next-generation chip bottleneck.
High NA EUV — High Numerical Aperture Extreme Ultraviolet — represents the next generation of EUV lithography, and the commitments from Samsung and TSMC indicate that both chipmakers view the technology as integral to their future manufacturing strategies. The dual commitment is significant because it aligns the two companies behind a single lithography platform at the same time.
The second pillar of the effort is scale. To realize the technology's full potential, the companies are driving a shared move toward larger, 12-inch formats. The joint character of the transition stands out: rather than pursuing it independently, Samsung and TSMC are pushing it together with ASML, an approach that spreads the engineering and adoption burden across the ecosystem rather than leaving it to any single player. Lithography transitions of this magnitude typically require toolmakers, chip manufacturers and the broader equipment base to move in concert, which is precisely the structure this collaboration establishes.
Taken together, the commitments sketch a coordinated path through the bottleneck: ASML supplies the next-generation lithography, Samsung and TSMC fold it into their production operations, and the shift to larger 12-inch formats proceeds as a shared project rather than a fragmented one. For an industry where lithography choices shape what chips can be built, the alignment of all three companies around High NA EUV marks the technology's arrival at the center of next-generation chip manufacturing.
Etiquetas: ASML · TSMC · Samsung · High NA EUV · Lithography · Semiconductor Manufacturing
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